China plans over $143 billion package to boost domestic chips, compete with US – Reuters
…
This is a premium post.
[s2If !current_user_can(access_s2member_level4)]Please register for PREMIUM VERSION HERE to read full post below containing analysis. In case of any error or you think you are not able to read the full post below, please email us at support#nehcap.com [lwa][/s2If] [s2If current_user_can(access_s2member_level4)]
Citing three sources, Reuters reported on Tuesday, China plans to allocate more than CNY1 trillion ($143 billion) as a support package to boost its domestic semiconductor industry.
“China plans to roll out a support package as soon as the first quarter of 2023, and over five years mainly as subsidies and tax credits.”
“The majority of financial assistance will be used to subsidize purchases of domestic semiconductor equipment by Chinese firms.”
developing story …
[/s2If]
Join Our Telegram Group
